The most common packaging method for full-color LED displays is SMD packaging, which is applied to indoor small pitch, indoor conventional, outdoor conventional products, and rental products. In some scenarios where the display effect is extremely demanding, in addition to using SMD packaging, COB packaging may also be involved. Today, following COB manufacturer DDON VISUAL, let’s take a look at the main differences between COB packaging and SMD packaging processes:

cob-led-display4

Firstly, structure and packaging method
1 COB, It directly encapsulates the LED light-emitting chip on the PCB substrate to form a surface light source. Unlike conventional SMD display point light sources, surface light sources can provide more uniform color expression and effectively suppress the generation of graininess. This method eliminates the need for traditional packaging brackets and pins, reduces component size, and makes the packaging more compact.
2 SMD, LED light-emitting devices with pins or pads installed on PCB substrates, including packaged LED light-emitting chips, are soldered onto the PCB board through surface mount technology. SMD packaged LEDs have a distinct independent light bead structure, with each bead being an independent point light source.

Secondly, packaging volume and density
1 COB, Removing the outer shell of the lamp beads can achieve smaller packaging volume and higher pixel density, which helps to reduce the pixel spacing of the display screen and improve display delicacy.
2 SMD, Due to the limitations of the physical size of each lamp bead, it is usually larger than the component size of COB packaging, and the pixel spacing will also be relatively large.

Indoor-LED-display-screen4

Thirdly, display effect
1 COB, It is closer to surface light source emission, providing more uniform display brightness and viewing angle, reducing graininess, and suitable for close range and long-term viewing.
2 SMD, The point light source emits light, and up close, the pixel structure can be seen. Manufacturers can ensure color consistency by sorting the optical performance of individual light beads. Therefore, SMD display products are more particular about the batch of use.

Fourth, protective power
1.COB, the LED light-emitting chip packaged in COB is wrapped with polymer material on the surface after packaging, which has better dust, moisture, and shock resistance performance. However, it should be noted that the maintenance of COB display screens usually requires returning to the factory.
2.SMD, Although the protection is inferior to its COB, repairing damage to a single light bead is more convenient, so subsequent maintenance is relatively more convenient.

Flexible-LED-display-screen5

Fifth, production difficulty
1.COB, Although COB displays simplify the production process and theoretically reduce costs, there are certain barriers for manufacturers to control the quality of light beads, update production processes, and purchase equipment in the early stages.
2.The production process and technology of SMD and SMD display screens are relatively mature, but the multi-step production process and additional material management may lead to increased costs.

Sixth, Application Fields
1.COB, Due to its small size and good protection, it is more suitable for high-end indoor conference rooms, command centers, broadcasting centers, remote dispatch centers, museums, science and technology museums, corporate exhibition halls, monitoring and operation centers, and other environments that require high display quality and are more complex.
2.SMD, Mainly used in our common indoor and outdoor scenarios, such as indoor shopping malls, gyms, company front desks, public displays, outdoor advertising, city squares, curtain wall advertising, etc., especially in projects that are cost sensitive and require high maintenance convenience.

Security monitoring

So, COB display screens and SMD display screen packaging can be said to have their own advantages. Users need to consider multiple aspects such as actual usage needs, project construction and application environment, and overall project budget when choosing which packaging technology product to use.

Leave a Comment

Your email address will not be published. Required fields are marked *

Scroll to Top